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Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

GlobeNewswire LogoGlobeNewswire15h ago

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America - GlobeNewswire

Quick Summary:

TEMPE, Ariz., May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.

Deca will help ensure IBM’s Bromont facility remains at the forefront of these innovations, strengthening our commitment to helping our clients bring products to market faster and deliver better performance for AI and data-heavy applications,” said Scott Sikorski, Head of Business Development for Chiplets & Advanced Packaging at IBM.

By combining IBM’s advanced packaging capabilities with Deca’s proven technology, the two companies are expanding the global supply chain for the future of high-performance chiplet integration and advanced computing systems.

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Article Details

Author / Journalist: Deca Technologies

Category: Technology

Markets:

Topics:

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2025-05-20 @ 09:01:00 (15 hours ago)

News Timezone: GMT +8:00

News Source URL: globenewswire.com

Language: English

Readers: 52 people read this story

Article Length: 442 words

Reading Time: 3 minutes read

Sentences: 15 lines

Sentence Length: 30 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © GlobeNewswire

News ID: 28869324

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About GlobeNewswire

Main Topics: Technology

Official Website: globenewswire.com

Update Frequency: 103 posts per day

Year Established: 1998

Headquarters: China

News Last Updated: 8 hours ago

Coverage Areas: China

Ownership: Independent Company

Publication Timezone: GMT +8:00

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News Language: English

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Website Security: Secure (HTTPS)

Publisher ID: #116

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